Wonderway SN42/Bi58 T4 Lead Free Solder Paste – No Clean, 138°C Melting Point, 30g x4

Overview

Wonderway SN42 Bi58 T4 is a lead free solder paste designed for reliable reflow across modern electronics and industrial equipment. With a 138°C melting point, it supports steady soldering while delivering bright weld points and consistent flow across joints. The no clean formulation reduces post processing and keeps workspaces cleaner during assembly.

Composition and Packaging

• Paste content: Tin 42% and Bi 58% alloy
• Flux content: 10.5%
• Total weight: 39 g per four pack bundle
• Net weight of paste: 30 g per pack, 4 packs in the set

Key Properties

• No clean formulation minimizes cleanup after soldering
• Strong viscosity supports smooth, controlled flow
• Bright welding point for clear joint visibility
• Pushing design favors smoother flowing and reduces waste during welding

Technical Notes and Benefits

The alloy composition paired with flux content is configured to enable stable wetting and reliable joints across a range of boards and components. The paste is suitable for reusable workflows where lead free, no clean options are preferred, helping production lines maintain efficiency and traceability without excessive post-processing steps.

Applications and Use Cases

Widely used for circuit boards, ICs, mobile phones, televisions, and other household appliances as well as industrial equipment. The combination of a moderate melting point and bright welds supports both routine assembly and repair tasks, providing a practical option for teams that value predictability in reflow soldering.

How to Use (Guidance)

Ensure surfaces are clean and prepared for soldering. Apply the paste with appropriate tools, observe a controlled reflow process, and inspect joints for bright, uniform welds. The formulation is designed to deliver consistent results across multiple joints in a single session.

Why Choose Wonderway

Wonderway blends chemistry and manufacturing discipline to offer a lead free, no clean solder paste that supports reliable joint formation with less post-work cleanup. Consider this option for electronics assemblies where a balanced combination of temperature control, flow, and joint clarity matters, without promising guarantees.